The AD7398/AD7399 family of quad, 12-bit/10-bit, voltageoutput digital-to-analog converters is designed to operate from a single 3 V to 5 V or a dual ±5 V supply. Built with Analog's robust CBCMOS process, this monolithic DAC offers the user low cost, and ease-of-use in single or dual-supply systems. The applied external reference VREF determines the full-scale output voltage. Valid VREF values include VSS < VREF < VDD that result in a wide selection of full-scale outputs. For multiplying applications ac inputs can be as large as ±5 VP.
A doubled-buffered serial-data interface offers high-speed, 3-wire, SPI and microcontroller-compatible inputs using serialdata- in (SDI), clock (CLK), and a chip-select (CS). A common level-sensitive load-DAC strobe (LDAC) input allows simultaneous update of all DAC outputs from previously loaded Input Registers. Additionally, an internal power ON reset forces the output voltage to zero at system turn ON. An external asynchronous reset (RS) also forces all registers to the zero code state. A programmable power-shutdown feature reduces power dissipation on unused DACs.
Both parts are offered in the same pinout to enable users to select the appropriate resolution for their application without redesigning the layout. For 8-bit resolution applications see the pin compatible AD7304 product.
The AD7398/AD7399 is specified over the extended industrial (40°C to +125°C) temperature range. Parts are available in wide body SOIC-16 and ultracompact thin 1.1 mm TSSOP- 16 packages.
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· Automotive Output Voltage Span· Portable Communications· Digitally Controlled Calibration· PC Peripherals
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` AD7398-12-Bit Resolution` AD7399-10-Bit Resolution` Programmable Power Shutdown` Single (3 V to 5 V) or Dual (5 V) Supply Operation` 3-Wire Serial SPI-Compatible Interface` Internal Power ON Reset` Double Buffered Registers for Simultaneous` Multichannel DAC Update` Four Separate Rail-to-Rail Reference Inputs` Thin Profile TSSOP-16 Package Available` Low Tempco 1.5 ppm/C
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VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . .0.3 V, +7 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . .+0.3 V, 7 V
VREF to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . .VSS, VDD
Logic Inputs to GND . . . . . . . . . . . . . . . . . . 0.3 V, +8 V
VOUT to GND . . . . . . . . . . . . . . .VSS 0.3 V, VDD + 0.3 V
IOUT Short Circuit to GND . . . . . . . . . . . . . . . . . . . 50 mA
Thermal Resistance JA
16-Lead SOIC Package (R-16) . . . . . . . . . . . . . 158°C/W
16-Lead Thin Shrink Surface Mount (RU-16) . . . 180°C/W
Maximum Junction Temperature (TJ Max) . . . . . . . .150°C
Package Power Dissipation . . . . . . . . . . .(TJ MaxTA)/JA
Operating Temperature Range . . . . . . .40°C to +125°C
Storage Temperature Range . . . . . . . . 65°C to +150°C
Lead Temperature
R-16 (Vapor Phase, 60 secs) . . . . . . . . . . . . . . . . . 215°C
RU-16 (Infrared, 15 secs) . . . . . . . . . . . . . . . . . . . . 224°C
Post a Buying Lead
Required Field 
